MÖZAK has developed numerous custom cleaning systems used by the semiconductor manufacturing industry. These systems fall into two main categories; Aqueous Solutions and Solvent Based Solutions. Most of our clients have previously established a manual cleaning process, they have sorted out their chemistry requirements, and they know if they need to brush or perhaps utilize an ultrasonic bath. However, these manual process solutions often times prove to be inadequate, they may be too labor intensive, inconsistent, produce relatively low yields, or simply do not adequately clean the part. We step in, to work with your Process team, to develop automated solutions that produce better results. Our systems have consistently produced higher yields, faster production, and generally all around better parts.
Our team can integrate your process into an automated solution or we can work to improve the process and automate at the same time. With dozens of custom systems installed in the field, we are confident that together we can achieve your goal for cleaner parts in less time.
Process Cleaning Tools: Wire Bond removal system, Wire Bond Weld Foot removal systems, brush cleaning systems, spray cleaning systems, solvent and other hazardous chemical based systems, chemical and aqueous bath systems, drying systems, ultrasonic systems, mega sonic systems, coating systems, and other precision cleaning equipment or subsystems.
Applications: Disk Drive read/write head manufacturing, sliders, slider bars, bond wire removal, bond foot removal, lapping tools, row tools, wafers, general semiconductor, compound semiconductor, CMOS image sensors, memory cards, Laser Diode, MEMS, nano-manufacturing applications, bioengineering applications, cassettes, and other fixtures.